Routability Driven Via Assignment Method for 2-Layer Ball Grid Array Packages

A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages

Fast Monotonic Via Assignment Excluding Mold Gates for 2-Layer Ball Grid Array Packages

Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer Ball Grid Array packages to support designers. Our method obtains a via assignment which distributes wires evenly on top layer and has high completion rati...

Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages

Thermal Characterization of Plastic Ball Grid Array Packages via Infrared Thermography

A methodology for performing characterization of Plastic Ball Grid Array (PBGA) packages via Infrared Thermography (IRT) was established. The thermal performance of various assemblies was characterized using IRT in conjunction with analytical methods to determine the individual contributions of the PBGA package and of the printed wiring board. Accuracy and repeatability of temperature measureme...

Transition from Plastic Ball Grid Array to High Performance Wire Bondable Tape Ball Grid Array

Mention Tape Ball Grid Array (TBGA) and the first thing comes to mind is the high cost. In fact, most end users rightfully associate TBGA with the less commonly practiced assembly processes such as Tape Automated Bonding (TAB) and expensive gold bump process. This impression of TBGA repels end users and limits TBGA to mostly high end applications and a very narrow spectrum of lead counts. Times...